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for right use of miniature relays do not exceed maximum ratings. do not use relays under exceeding conditions such as over ambient temperatur e, over voltage and over current. incorrect use could result in abnormal heat ing, damage to related par ts or cause burning. read cautions in the selection guide. read the cautions described in nec/to kin's "miniature relays" when you choose relays for your application. the information in this document is subject to change without notice. document no. 0610emdd03vol02e date published may 2005 p printed in japan ? nec tokin corporation 2002 data sheet miniature signal relay ed2/ef2 series ultra-low power, compact and lightweight, high breakdown voltage, surface mounting type description nec tokin's new miniature signal relays, ed2/ef2 seri es, achieved 50 mw of ultr a low power consumption. features low power consumption (50 mw) applicable for the surge voltage standard of fcc (1500 v, 10 160 s) and telcordia (2500 v, 2 10 s) two types for through-hole mounting (ed2 se ries) and surface mounting (ef2 series) variation of dense mounting type and/or long-joint-life type for latest smt ? compatible configuration and terminal alloca tion with dense mounting type of ee2 series ? upgraded soldering joint reliability between the relay terminal and pcb by optimization of the terminal configuration; 20-year-joint-life under 35c-per-day-temperat ure-difference specified in ipc-sm-785 for telecommuication equipment applications electronic switching systems, pbx , terminal equipment, telephone system.
ed2/ef2 series 2 di mensions and p ad layouts (unit : mm (inch)) ed2 series ef2 series
ed2/ef2 series 3 pin configurations (bottom view) ed2 series ef2 series markings (top view) safety standard and rating tuv certified (en60255/iec60255) ul recognized (ul508)* file no e73266 csa certificated (csa c22.2 no14) file no lr46266 no.9950557 nonlatch and single-coil latch 30 vdc, 1 a (resistive) 110 vdc, 0.3 a (resistive) 125 vac, 0.5 a (resistive) creepage and clearance of coil to contact is over than 2 mm (according en60950) * spacing : ul114, ul478 basic insulation class
ed2/ef2 series 4 performance characteristics contact form 2 form c maximum switching power 30 w (resistive) 62.5 va (resistive) maximum switching voltage 220 vdc 250 vac maximum switching current 1 a contact ratings maximum carrying current 2 a minimum contact ratings 10 mv. dc, 10 a ?? 4 initial contact resistance 75 m ? max. (initial) contact material silver alloy with gold alloy overlay non-latch type 50 to 70 mw single coil latch type 30 to 80 mw nominal operating power double latch type 50 to 80 mw operate time (excluding b ounce) approximately 3 ms release time (excluding bounce) approximately 2 ms without diode insulation resistance 1000 m ? at 500 vdc between open contacts between adjacent contacts 1000 vac for one minute (1500 v surge, (10 160 s ??1 ) breakdown voltage between coil to contact non-latch type and single-coil latch type 1500 vac for one minute (2500 v surge, 2 10 s ??2 ) double-coil latch type 1000 vac for one minute (1500 v surge, 10 160 s ??1 ) shock resistance 735 m / s 2 (misoperating) 980 m / s 2 (destructive failure) vibration resistance 10 to 55 hz at double amplitude at 3 mm (misoperating) 10 to 55 hz, double amplitude of 5 mm (destructive failure) non-latch type (additional ?n?): - 40 to +85c non-latch type (standard): - 40 to +70c ambient temperature latch type : - 40 to +70c coil temperature rise 7 degrees at nominal coil voltage (50 mw) 1 10 8 ??3 operations (non-latch type) no-load 1 10 7 operations (latch type) 50 vdc 0.1 a (resistive), 1 10 6 operations at 70c running specifications load 10 vdc 10 ma (resistive), 1 10 6 operations at 70c weight approximately 2.2 grams ??1 rise time : 10 s, decay time to half crest : 160 s ??2 rise time : 2 s, decay time to half crest : 10 s ??3 this shows a number of operation where it can be running by which a fatal defect is not caused, and a number of operation by which a steady characte ristic is maintained is 1 10 7 operations. ??4 this value is a reference value in the resistance load. minimum capacity changes depending on seitching fr equency and environment temperature and the load. recommended relay drive conditions drive under conditions. if it is impossible, please inquire to nec. additional ?n? type of non-latch ambient temperature - 40 to +85c standard type of non-latch voltage: within 5% at nominal voltage ambient temperature - 40 to +70c single coil latch type square pulse (rise and fall time is rapidly) pulse height : within 5% at nominal voltage pulse width : more than 10 ms ambient temperature - 40 to +70c
ed2/ef2 series 5 p art number system note 1. t here are two specication in oper ate voltage of non-latch ty pe rela y. egatlov etarepo tsum rebmun trap additional ?n? ty pe e d2- nu - nj 75% standard ty pe e d2- 80% : nominal coil voltage note 2. t here are two specication in oper ate voltage of non-latch ty pe rela y. egatlov etarepo tsum rebmun trap additional ?n? ty pe e d2- nu - nux - nuh 75% standard ty pe ef2- 80% : nominal coil voltage
ed2/ef2 series 6 nominal lineup (community) non-latch type (standard) at 20c nominal coil voltage (vdc) coil resistance ( ? ) 10 % must operate voltage (vdc) must release voltage (vdc) nominal operate power (mw) 1.5 45 1.2 0.15 50 3 180 2.4 0.3 50 4.5 405 3.6 0.45 50 5 500 4 0.5 50 6 720 4.8 0.6 50 9 1473 7.2 0.9 55 12 2400 9.6 1.2 60 24 8229 19.2 2.4 70 non-latch type (additional ?n?) at 20c nominal coil voltage (vdc) coil resistance ( ? ) 10 % must operate voltage (vdc) must release voltage (vdc) nominal operate power (mw) 1.5 45 1.13 0.15 50 3 180 2.25 0.3 50 4.5 405 3.38 0.45 50 5 500 3.75 0.5 50 6 720 4.5 0.6 50 9 1473 6.75 0.9 55 12 2400 9 1.2 60 24 8229 18 2.4 70 single-coil latch type at 20c nominal coil voltage (vdc) coil resistance ( ? ) 10 % must operate voltage (vdc) must release voltage (vdc) nominal operate power (mw) 1.5 75 1.2 1.2 30 3 300 2.4 2.4 30 4.5 675 3.6 3.6 30 5 833 4 4 30 6 1200 4.8 4.8 30 9 2700 7.2 7.2 30 12 4800 9.6 9.6 30 24 7200 19.2 19.2 80
ed2/ef2 series 7 doubl e - coil lat c h t y pe at 20c no m inal coil v ol t age (vdc) coi l resistanc e ( ) 10 % must operate v ol t age (vdc) must release v ol t age (vdc) nomina l ope r a t e po w e r (mw) s 45 1. 5 r 45 1 . 2 5 0 s 180 3 r 180 2 . 4 5 0 s 405 4. 5 r 405 3 . 6 5 0 s 500 5 r 500 4 5 0 s 720 6 r 720 4 . 8 5 0 s 1620 9 r 1620 7 . 2 5 0 s 2880 1 2 r 2880 9 . 6 5 0 2.4 3.6 4 4.8 7.2 9.6 1 . 2
ed2/ef2 series 8 performance data ?? coil temperature rise temperature is measur ed by coil resistance. ?? switching capacity this is allowed maximum value. inquiry for nec/tokin under maxi mum value at continuous use. ?? maximum coil voltage this is maximum value of permissible alteration. inquiry for nec/tokin at continuous use.
ed2/ef2 series 9 ?? applied voltage vs. timing (sample: ed2-5nu) ?? operate and release voltage vs. ambient temperature this shows a typical change of operate (release) voltage. maximum value of operate es timated, so it must be applied more than this value for safety operation. in case of ?hot start operation?, please inquiry for nec/tokin. (latch type and standard type of non-latch) (additional ?n? type of non-latch)
ed2/ef2 series 10 ?? running test (nonload) (load: none, driving: 5v.dc, 50 hz, 50% duty, ambient te mperature: room temperature, sample: ed2-5nu 20 pieces) ?? running test (load) (load: 50 v.dc 0.1 a resistive, driving: 5v.dc, 5 hz, 50% duty, ambient temperature: 85 degree c, sample: ed2-5nu 10 pieces) ?? breakdown voltage sample: ed2-5nu 10 pieces
ed2/ef2 series 11 ?? alternation of voltage at densely mounting (magnet interference)
ed2/ef2 series 12 tube package (ed2, ef2) dimension of package (unit : mm) outline of package tape package (ef2) appearance tape dimension mm (inch) relay orientation mark and tape carrying direction.
ed2/ef2 series 13 soldering temperature condition through?hole mounting type (ed2) ?@ automatic soldering * preheating : 100c max. 1 minute max. * solder temperature : 260c max. * solder time : 5 seconds max. ?a manual soldering * solder temperature : 350c max. * solder time : 3 seconds max. surface mounting type (ef2) note: 1. temperature profile shows printed circuit board surface temperature on the relay terminal portion. 2. check the actual soldering c ondition to use other method except above mentioned temperature profiles.
ed2/ef2 series 14 notes on correct use 1. notes on contact load make sure that the contact load is within the specified range; otherwise, the lifetime of the contacts will be shortened considerably. note that the running performance shown is an example, and that it varies depending on parameters such as the type of load, switching frequency, driver circuit, and ambient temperature under the actual operating conditions. evaluate the performance by using the actual circuit before using the relay. 2. driving relays - if the internal connection diagram of a relay shows + and - symbols on the coil, apply the rated voltage to the relay in the specified direction. if a rippled dc current source is used, abnormalities such as beat at the coil may occur. - the maximum voltage that can be applied to the coil of the relay varies depending on the ambient temperature. generally, the higher the voltage applied to the coil, the shorter the operating time. note, however, that a high voltage also increases the bounce of the contacts and the contact opening and closing frequency, which may shorten the lifetime of the contacts. - if the driving voltage waveform of the relay coil rises and falls gradually, the inherent performance of the relay may not be fully realized. make sure that the voltage waveform instantaneously rises and falls as a pulse. - for a latching relay, apply a voltage to the coil according to the polarity specified in the internal connection diagram of the relay. - if a current is applied to the coil over a long period of time, the coil temperature rises, promoting generation of organic gas inside the relay, which may result in faulty contacts. in this case, use of a latching relay is recommended. - the operating time and release time indicate the time required for each contact to close after the voltage has been applied to or removed from the coil. however, because the relay has a mechanical structure, a bounce state exists at the end of the operating and release times. furthermore, because additional time is required until the contact stabilizes after being in a high-resistance state, care must be taken when using the relay at high speeds. 3. operating environment - make sure that the relay mounted in the application set is used within the specified temperature range. use of a relay at a temperature outside this range may adversely affect insulation or contact performance. - if the relay is used for a long period of time in highly humid (rh 85% or higher) environment, moisture may be absorbed into the relay. this moisture may react with the nox and sox generated by glow discharges that occur when the contacts are opened or closed, producing nitric or sulfuric acid. if this happens, the acid produced may corrode the metallic parts of the relay, causing operational malfunction. - because the operating temperature range varies depending on the humidity, use the relay in the temperature range illustrated in the figure below. prevent the relay from being frozen and avoid the generation of condensation. - the relay maintains constant sealability under normal atmospheric pressure (810 to 1,200 hpa). its sealability may be degraded or the relay may be deformed and malfunction if it is used under barometric conditions exceeding the specified range. - the same applies when the relay is stored or transported. keep the upper-limit value of the temperature to which the relay is exposed after it is removed from the carton box to within 50c. - if excessive vibration or shock is applied to the relay, it may malfunction and the contacts remain closed. vibration or shock applied to the relay during operation may cause considerable damage to or wearing of the contacts. note that operation of a snap switch mounted close to the relay or shock due to the operation of magnetic solenoid may also cause malfunctioning. 4. notes on mounting relays - when mounting a relay onto a pc board using an automatic chip mounter, if excessive force is applied to the cover of the relay when the relay is chucked or inserted, the cover may be damaged or the characteristics of the relay degraded. keep the force applied to the relay to within 1 kg. - avoid bending the pins to temporarily secure the relay to the pc board. bending the pins may degrade sealability or adversely affect the internal mechanism. - it is recommended to solder the relay onto a pc board under the following conditions: <1> reflow soldering refer to the recommended soldering temperature profile. <2> flow soldering solder temperature: 260c max., time: 5 seconds max, preheating: 100c max./1 minute max. <3> manual soldering solder temperature: 350c, time: 2 to 3 seconds - ventilation immediately after soldering is recommended. avoid immersing the relay in cleaning solvent immediately after soldering due to the danger of thermal shock being applied to the relay. - use an alcohol-based or water-based cleaning solvent. never use thinner and benzene because they may damage the relay housing. - do not use ultrasonic cleaning because the vibration energy generated by the ultrasonic waves may cause the contacts to remain closed. 5. handling - relays are packaged in magazine cases for shipment. if a space is created in the case after some relays have been removed, be sure to insert a stopper to secure the remaining relays in the case. if relays are not well secured, vibration during transportation may cause malfunctioning of the contacts. - exercise care in handling the relay so as to avoid dropping it or allowing it to fall. do not use a relay that has been dropped. if a relay drops from a workbench to the floor, a shock of 9,800 m/s2 (1,000 g) or more is applied to the relay, possibly damaging its functions. even if a light shock has been applied to the relay, thoroughly evaluate its operation before using it. - latching relays are factory-set to the reset state for shipment. a latching relay may be set, however, by vibration or shock applied while being transported. be sure to forcibly reset the relay before using it in the application set. also note that the relay may be set by unexpected vibration or shock when it is used in a portable set. - the sealability of a surface-mount relay may be lost if the relay absorbs moisture and is then heated during soldering. when storing relays, therefore, observe the following points: <1> please use relays within 12 months after delivery. (storage conditions : 30 degrees c / 60% rh) <2> for mbb packing, please use relays within 2 years after delivery. (stronge conditions : 30 degrees c / 60% rh) after opening mbb packing, please use within 3 months. (storage conditions : 30 degrees c/ 60% rh)
ed2/ef2 series no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec/tokin corporation. nec/tokin corporation assumes no responsibility for any errors which may appear in this document. nec/tokin corporation does not assume any liabilit y for infringement of patent s, copyrights or other intellectual property rights of third parties by or arisi ng from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or ot herwise, is granted under any patents, copyrights or other intellectual property rights of nec/tokin corporation or others. while nec/tokin corporation has been making continuous effort to enhance the reliability of its electronic components, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec/tokin electronic compo nent, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-c ontainment, and anti-failure f eatures. nec/tokin devices are classified into the following three quality grades: "standard", "special", and "specific". the specific quality grade applie s only to devices developed based on a customer designated "quality assurance program" for a specific application. the re commended applications of a device depend on its quality grade, as indicated below. cu stomers must check the qu ality grade of each device before using it in a particular application. standard: computers, office eq uipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic a ppliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (aut omobiles, trains, ships, etc.), traf fic control systems, anti-disaster systems, anti-crime systems, safety equipmen t and medical equipment (not specifically designed for life support) specific: aircrafts, aerospace equipment, submersible repeaters, nuclear reacto r control systems, life support systems or medical equi pment for life support, etc. the quality grade of nec/tokin devices is "standard" unless otherwise s pecified in nec/tokin's data sheets or data books. if customers intend to use nec/tokin devices for applications other than those specified for standard quality grade, they shoul d contact an nec/tokin sales representative in advance. (note) (1) "nec/tokin" as used in this statement means nec/tokin corporation and also includes its majorityowned subsidiaries. (2) "nec/tokin electronic component products" means any electronic component product developed or manufactured by or for ne c/tokin (as defined above). de0202
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